What patent did China state electron win in respect of technology of low power comsumption?

China state electron owns multinomial patent in respect of technology of low power comsumption, it is a part below relevant patent introduces:

• Semiconductor puts saving place: Accredit announcement date is CN114694708B. This patent uses design of new-style memory framework, pass algorithm of built-in in location intelligence, optimize data automatically to read keep technological process. Introduce at the same time brand-new can effect management technique, can adjust power comsumption according to operating effective demand trends, can move in the stability below high temperature environment, reduce integral system power comsumption.
• Break memory and the control method that its decide electric mechanism easily: Public order is CN119068924A. This patent offerred a kind to break electric mechanism to control a method, can be in receive cut off the power when the command, during whether judgement is in movement of clump hairdo refresh to operate, and time of second refresh movement is mixed before the basis refresh time span, computation is current time and the next time the time of refresh movement is wrong, whether to start the pattern of job of small electric current that breaks memory easily with this decision, increase the stability that memory issues in environment of small electric current.
• Storage device reachs his to be read continuously write a method: This patent is passed distinctive read continuously write a method, realize faster data to visit speed, reducing specific power consumption while the stability that increases data and dependability, theoretic can will read write speed to promote to hundreds MB/s, the data processing that applicable issues at cloud computation and big data environment.
• Three-dimensional chip: Public order is CN119108358A. This patent uses 3D stack technology and combine heterogeneous bond technology, those who offer tall bandwidth low power comsumption is odd a 1Gb to 8Gb memory, strengthened bandwidth and reduce the electric power that when data is transmitted, needs. Wait for a design through temperature sensor is being installed on chip at the same time, conduce to the stability in promoting chip to apply in high power, move for low power comsumption secondhand provide safeguard.