The schism semiconductor of the semiconductor that bring a life how?

Nexperia company released a series of schism semiconductor products that accord with AEC-Q101 standard recently, these products are not aimed at car application domain especially. These products used DFN (schism type is compressed without cite a base) enclose, efficiency of high fever of this apparel equipment, economic space and compatible AOI detect wait for a lot of advantage. This all fronts product that a series of products covered Nexperia, include the diode of all sorts of types, transistor and LED drive.

Nexperia is not had for what automobile industry provided a variety of specification bring a foot to enclose schism parts of an apparatus, dimension arrives from very small DFN1006BD-2 (1 X 0.6 X 0.5 Mm) largish DFN2020D-3 (2 X 2 X 0.65 Mm) , still have newest issuance DFN1110D-3 and DFN1412D-3. The parts of an apparatus that these DFN enclose takes up the space is dinky, the smallest have 0.6 Mm2 only, enclose photograph comparing with traditional SOT23, can save the PCB space that is as high as 90% . Its excellent hot performance (RTHJ-S) mean these parts of an apparatus to be in take up the state of affairs with less space falls, can offer identical better even medicinal powder hot effect, make the function of whole system more reliable thereby. Be worth what carry is, the DFN of Nexperia encloses a technology to be able to bear the working temperature that is as high as 175 ° C.

In considering AOI is in certain applying, especially the importance in automobile industry, nexperia is in early took the lead in 2010 research and development went out to take solderability side (the DFN of SWF) is enclosed, this kind encloses the solution that had made a maturity now. SWF makes the solder dot after soldering OK by the examination, still enhanced strength of PCB connective machinery at the same time, raised circuit board fight curve ability.

Of Nexperia ambipolar model vice president of department of career of schism parts of an apparatus held general manager Mark Roeloffzen concurrently to emphasize a series of this car class DFN enclosing a product to offer more alternatives for the engineer, conveyed a company to lead the determination of the market through enclosing innovation.

Current, these schism semiconductor products that introduce DFN to enclose had thrown a quantity to produce, and Nexperia plan raised high yield further 2020 can, in order to offer combination of comprehensive product of schism parts of an apparatus, include to resemble BC847, BC817 and BAV99 among them product of such high power level.