The New Progress of High Efficiency Power Electronic Field
More intelligent power components
Smart power IC is a new device integrated smart and power in a chip. It is widely used in power converters, motor control, fluorescent rectifier, automatic switch, video amplifiers, and bridge type drive circuit and display drivers. China is the world’s largest consumer electronics market, as people living standard rise ceaselessly, the demands of various electronic products are increasing, foreshadowing that the smart power integrated circuit has a huge market.
Smart power IC uses bipolar/CMOS/DMOS (BCD) technology, making simulation, digital, and power system design to integrate in the monolithic substrate. Subsequent BCD improved high-voltage isolation, digital feature sizes (providing higher simulation accuracy, logic speed, density, etc.) and power management skills. Modern technology can integrate digital processor, RAM/ROM memory, embedded type memory and power driver. For example, adopting the BCD process can integrate power supply, logic and simulation, and many other functions in single chip.
With the continuous narrow physical dimension of CMOS, high embedded smart needs lead to the integration of 16/32 processor, multi MbROM/RAM and non-volatile memory, and complex digital intellectual property (IP). In order to make module have higher precision sensor mechanism, high bitrates data conversion and different interface protocols, the drive/control loop, and accurate reference voltage/current, simulated function also is in the increase. The industry has already come out with 100 to 200 V and 5 to 10 A power driver. These devices with low conductivity impedance, and high density, high voltage isolation structure strength type of using of deep groove and insulation silicon silicon-on-insulator (SOI) technology.
Integrated 600 V transistor technology used in AC-DC inverter supplement with technology used in below 100 V applications is proved to be another important market. Advanced sub-micron CMOS process will promote low cost, low conductivity impedance of the drive from traditional LDMOS device to integrate double and three low surface electric field DMOS, super LDMOS and LIGBT.
The potential of packaging technology
The main trend of the current power semiconductor packaging is to enhance interconnection, including wafer level technology in order to reduce the effect of the impedance/parasitic effect, and enhance heat dissipation. Thick copper, gold or aluminum wire combination, ribbon/ clip bonding, and power optimization chip level packaging (CSP) also enhances the resistance connection efficiency of bare chip and external electrode.
As for power module, it is embedded by power electronic devices in a certain function combination. It is exactly is a kind of packaging technology. The early power module in a single package integrated multi thyristor/rectifier, which provides higher rated power. Over the past 30 years, the major breakthrough in today’s power module is to combined semiconductor and sensor, driving, protection and control function together.
For example, intelligent power module is advanced hybrid integrated power components as IGBT to be the core. It is combined by high speed, low power tube (IGBT) and optimized gate pole driving circuit, and fast protection circuit. IGBT In the core of IPM chooses high speed type, and drive circuit abuts IGBT, drive delay is small, so the IPM switch has fast speed, and the consumption is small. The internal IPM integrated real-time detection circuit which can continuously detect IGBT current and temperature, and when serious overload even directly short circuit and temperature overheats happened, IGBT will be shut off and emit out fault signal.
Module uses DBC technology enhanced the electrical properties, and ceramic substrate can simultaneously ascend cooling efficiency. Packaging-assembly technical improvements realized several bare chip and passive components of co-integration and the vertical stack technology which used to increase the degree of system integration. The Un-packaging technology is the other field of significant study field; this technology will integrate a few of substrate machinery with devices on, exempt from shell, terminal and base.