The HyperRAM of China state electron? What is the development trend of technical future?

The HyperRAM of China state electron? Technical future will forward lower power comsumption, more high-powered, smaller enclose the direction such as domain of dimension, wider application and standard standardization to develop, specific as follows:

• Lower power comsumption: HyperRAM? Aim to replace traditional SDRAM from design concept in order to reduce power comsumption, future can last this one trend. Enclose a product like the 1.2V WLCSP that rolled out 2023 and 1.35V BGA49, relatively 1.8V product power comsumption is more economic 33% . Future is passed advanced make circuit of low power comsumption of Cheng and innovation design, its power comsumption will be reduced further.
• More high-powered: Will use the more advanced technology that make Cheng 2025, promote the index such as capacity, speed. At present HyperRAM? Top job frequency can amount to 200MHz, data transmission rate is as high as 800MBps, follow-up hopeful realizes taller data to transmit rate and larger size, with satisfying the high-powered demand that increases increasingly.
• Smaller enclose dimension: Enclose dimension to will narrow continuously, arrive from the TSOP BG60/54 of SDRAM HyperRAM BGA24, and the BGA49 of 4x4mm2 encloses WLCSP to brilliant round class, future is passed more advanced enclose a technology, if 2.5D or 3D enclose a technology, can narrow further enclose dimension, reduce circuit board to take up space.
• Use a field more extensively: Mix by right of low power comsumption small enclose the advantage such as dimension, its apply more at the lightweight AI application such as processing of image of keyword identifying, SD. Also can be in at the same time development of intelligent car domain applies, wait for setting like appearance dial, lidar, still apply to the equipment such as robot of margin calculation server, cooperation.
• Standard standardization: HyperRAM? Will bring into JEDEC standard standard, make compatible technology, this will make its ecosystem more mature, does the person that wait for banner course of study as NXP, Renesas, ST, TI support HyperBus continuously? The MCU of interface, future can have more manufacturer be based on standard standard to develop relevant product, quicken its to popularize application.
• With other technology confluence: Adopt Hybrid Bonding technology, hopeful realizes taller precision and lower power comsumption further. Future may as shirt-sleeve as more advanced technique, if be united in wedlock with KGD 2.0 technology, more efficient replacement scheme is offerred in AI – ISP and CPU design for the client.