TD-LET Chips Face Challenge & Support

Chip terminal ability mature is an important link in international development of TD-LTE. Under the leading of QUALCOMM and Ericsson, Intel, Nvidia, Marvell, Hisilicon etc have become manufacturers with outstanding product ability, which in succession plan to launch end multimode TD-LTE chip. The support TD-LTE got has been far higher than TD-SCDMA era.

Early layout

Chip and system equipment development are very different, as soon as system equipment has ground floor technology and equipment foundation, it is not far to realize the basic functions. After improving equipment reliability and further optimizing cost, it will be launch to the market. And chip mass production should experience various commercial pretesting. If adding adjustment of the protocol stack, the adjustment of the physical link may need more time.

Are therefore, currently enterprises on the market in LTE leading the direction of the terminal chip have early layout.

Because LTE chip have a high level of integration, multi-mode, cross operation system, high processing power, multimedia performance and low power consumption, software and hardware combination characteristics, Ericsson occupies with Nokia and Quanda demonstrates the tablet computer, booklet and other terminals based on its chip development, this year’s product is to put more focus on the chip multimode LTE, in the second quarter of this year LTE reference design has already sent to test link.

Commercial products need more than 2 or 3 times flow pieces to complete. 2 G / 3 G / 4 G hybrid networking mode will continue for a long time, this requires terminal chip can support multi technology, multi frequency band, multi data rate and various business, greatly increased the complexity of the chip. In addition, the chip of baseband/multimedia/rf integration demand has become a trend and terminal prices are falling, thus the cost pressure of the chip link is growing. For TD-LTE concerned, the biggest difficulties of the whole industry chain is in chip terminal link. Of course, in many excellent chip company’s efforts, the so-called “bottleneck” situation won’t form again.