High Integrated Level Chip Demand Booms
Data business growth passed voice business. It supported the exploring development of Mobile Internet in this year. In order to meet the requirements of end user to smooth user experience and access network at any time, high treatment, mobility and low power consumption chip technology are posed to the more important position.
Data applications inspire chip innovation
The micro blog, instant messaging (IM), etc, the most popular mobile Internet application in this year, inspired global terminal manufacturers put the main energy on intelligent terminal market. The fierce market competition pushed the high integrated level chip to be favored by more and more terminal enterprises because of its unique design and the cost advantage. In this tendency, the mainstream chip enterprise this year have all issued a series of intelligent terminal chip solutions, bringing intelligent terminal chip into multi nuclear, high computing power stage.
Qualcomm is the first to launch the revolutionary chip products in the industry in the first half of this year, including the world’s first HSPA chip, 3 G/LTE multimode chip, the world’s first 1 GHz Snapdragon mobile mononuclear chip. The Snapdragon products in online also launched a 1.4 GHz mobile world’s first mononuclear chip, the world’s first 1.5 GHz dual-core chip, and the new mononuclear, dual-core, four nuclear chipset based on new micro structure, and the mononuclear highest speed can reach 2.5 GHz.
TI (Texas instruments) key released a new generation OMAP5 platform this year, OMAP5 based on ARMCortexA15 framework, which has a 2 GHz main frequency performance.
On supporting 3D technology, NVIDIA Tegra2 chip walked at the front of industrial chain. The 3D OptimusPad of LG is using NVIDIA Tegra2 dual-core CPU. In addition to applied to Pad, known as the “super chip” Tegra2 also is applied to many mainstream brands in the mobile phone. Broadcom companies are also actively expanding smartphone and tablet computer field, and it launched its dual-core processor platform BCM28150.
Facing the huge demand intelligent terminal market, MTK supported Android phone whole solution MT6573, according to in high-end market, MTK also launched a EDGE mobile phone chips MT6236, highlighting the function of the powerful CPU.
From the chip market competition, dual-core war is boom, core power upgrade brings the accelerated development of end products. The next step, the performance of the smart phone is expected to surpass a real computer.
TD chip ability confirmed
In TD intelligent terminal chip technology development, the chip is transferring from single-mode into the moltimode, TD multi nuclear single chip solutions is being widely adopted. And in this year, TD chip market due to Marvell, the join of the international brand of core technology, TDK independent operation competition is more intenser
TD early development has many advantages in Modem baseband links, but it started late, plus the chip itself the development cycle is long, from previous integration, process, power consumption, 3 G is better than it. However, through the effort of most chip manufacturers, in many indexes TD chip has reached maturity 3 G product standards, this directly prompted TD this year’s leap intelligent terminals of development.
Summarizing the previous TD chip problems, including TDK, a number of manufacturers introduced new TD chips, and it will reduce standby power down to 3.5 mA, LC1710 of TDK claimed that “TD solid unit can be 200 Yuan, TD function machine can be 500 Yuan, and based on a large number of commercial verification TD protocol stack guarantee the stable operation of the terminal.