COB Packaging Becomes Development Trend

Given the impact of the debt crisis in Europe and the United States in 2011, coupled with the chain scission crisis triggered by the earthquake in Japan’s Tokyo and Thailand century floods, global electronics manufacturing suffered serious blow. As a part of electronics manufacturing, LED industry is also coming in at micro-profit era. Industry expert pointed out facing the increasing competition but bright market outlook, LED manufacturers should continue to reduce production cost to survive. COB packaging is a choice to cut cost.

With the gradual maturity of LED application market, users posing increasingly high requirements for the stability and reliability of product, especially on the basis of same conditions, there requires product to achieve better energy efficiency indicators, lower power consumption, as well as a more competitive product price. As such, comparing with traditional LED SMD package and large-power package, chip on board (COB) integrated packaging technology can directly encapsulate multi LED chips on the metal base printed circuit board as a lighting module to directly cooling through the substrate, so that COB can not only reduce stent manufacturing process and its costs, but also show advantage of reducing the thermal resistance of the cooling, so it become a LED lighting module packaging technology strong promoted by currently many large manufacturers.

In addition to good thermal performance, low cost, COB light source can also provide personalized design.

At present, the COB packaging bulb accounted for about 40% of the LED bulb market, a number of enterprises in China all begin to move to COB packaging model. The industry sources predict COB packaging will become an inevitable trend of LED packaging in the future.

Gong Wen, the chief engineer of Shenzhen Kinglihgt Optoelectronic Co., Ltd, COB, as a integrated light source, decreases stents cost. With the continual improvement of COB technology and the continuous maturity of the ceramic substrate and other new emerging technologies, it is certain the usage of COB package will further increase.

It is reported that Japan’s Sharp has adopted COB ceramic substrate to produce LED lighting. However, COB package also shows shortcomings of light attenuation, short life and bad reliability.