Brilliant round class of Zhuo Shengwei encloses working principle of the technology

Brilliant round class of Zhuo Shengwei encloses a technology (WLP, wafer Level Package) be be in one kind brilliant circle was opposite directly before cut the advanced technique that whole brilliant circle has enclosing machining, its core principle is to pass what finish chip in brilliant round level to enclose, the craft such as interconnection, protection, final implementation is chip miniaturization, tall compositive spend and high-powered target. Detachable solution is specific work principle the following crucial link:

One, the core that brilliant round class encloses is logistic: From ” odd chip is enclosed ” to ” whole brilliant circle is machined “

Traditional chip is enclosed is normally it is brilliant circular cut individual naked chip first (Die) , undertake to individual chip down-lead bond, model is sealed again wait for craft; And circle class encloses brilliant to be jumped over ” cut ” link, undertake in order to make a brilliant circle enclosing flow for the unit directly, after finishing again cut is become individual the chip that has enclosed. This kind of mode reduced the treatment measure of individual chip considerably, the efficiency of batch processing promotion that adopts brilliant round form at the same time, reduce cost, come true smaller enclose dimension (approach chip itself size, namely ” chip class is enclosed ” ) .

2, critical process measure and principle

The character that filter brilliant round class of Zhuo Shengwei encloses a technology to be aimed at filter of radio frequency front (if high frequency signal is transmitted, interference rejection demand, miniaturization asks to wait) , in circle of current any crystalline substance class is enclosed undertook on the foundation custom-built change optimize, core measure includes:

1.Brilliant round pretreatment and exterior preparation

• Principle: Round to finishing production filter any crystalline substance (the semiconductor brilliant of filter of the circle of the brilliant that suppress report that is like SAW filter, BAW is round) undertake exterior cleanness, flatness is handled, purify impurity and blemish, enclose craft to provide stable base for sequel.
• Radio frequency is comfortable deserve to optimize: The high frequency signal that is aimed at filter transmits demand, need to ensure brilliant round face is disturbed without redundant medium, avoid signal loss or reflex.

2.** Redistribution Layer (RDL, heavy wiring layer) preparation **

• Principle: Through photoetching, eletroplate wait for craft to make metallic wiring layer in brilliant round face (it is copper or aluminium normally) , the Pad chip interior (solder dish) from original position ” heavy wiring ” to enclose external I/O solder dish, realize the interconnection of chip and exterior circuit.
• Advantage: RDL can design wiring trend neatly, break through the dimensional limitation of traditional down-lead bond, support more I/O port, short message date shrinks to transmit method in the meantime, reduce the defer of high frequency signal and loss, comfortable match the filter requirement to signal integrality.

3.Enclose covering layer to form

• Principle: In brilliant round face (include chip and RDL layer) besmear Fu insulation protects data (if epoxy resin, nitrogen changes silicon to wait) , through photoetching the definition opens window area (show exterior solder dish) , the physical protection that forms pair of chip core structures and environmental segregation (moistureproof, antirust, prevent damage) .
• Filter is comfortable match: Covering layer needs to have low dielectric constant, tall insulating properties, the high frequency signal that avoids pair of filter generates interference, the high reliability that satisfies the setting such as car electron at the same time asks (if be able to bear or endure lukewarm, be able to bear or endure oscillatory) .

4.Protruding is nodded (Bump) make

• Principle: The exterior solder in RDL layer dish protruding of the positional metal that make is nodded (protruding of column of the ball that be like stannum, copper is nodded) , as the chip after enclosing with the join dot of PCB board or other model group. The measure that protruding orders and span can be designed according to demand, support high density interconnection.
• Action: The golden line that replaces traditional down-lead bond / copper cash, realize closer connection, narrow further enclose bulk, at the same time promotion heat conducts efficiency, help filter comes loose hot (especially when high frequency job) .

5.Brilliant circular cut and test

• Principle: After finishing afore-mentioned craft, cut facility closely through essence of life (like cut of laser cut, diamond razor blade) circle of will whole brilliant is broken up for individual the chip that has enclosed (WLP chip) , along with junior travel final electricity performance checks (if the frequency of filter is answered, insert loss, segregation to spend etc) , choose eligible product.

3, the technology that is aimed at filter optimizes direction

Brilliant round class of Zhuo Shengwei encloses a technology to combine filter (especially SAW, MAX-SAW) characteristic, undertook in the following respect specific aim designs:

• Small loss interconnection: Through optimizing RDL metal stuff (be like tall conductivity copper) with wiring structure, reduce high frequency signal the loss in transmit, ensure the insertion of filter loss index amounts to mark.
• Miniaturization and compositive change: Through brilliant circle class batch is machined, enclose dimension to be close to chip itself (dimension is cut 30% above) , amplifier of supportive filter and radio frequency switch, low noise (LNA) wait for collect to make modular group (like L-PAMiD) , contented smartphone, intelligence apparels those who wait for equipment is frivolous change requirement.
• Different compose is compositive and compatible: The different compose that support is based on round carrier of 12 inches of brilliant is compositive, but the chip of will different technology (be like amplifier of filter, power) through brilliant circle class encloses pile or side by side compositive, realize taller systematic level function, if eminent gets the better of small L-PAMiD model group namely compositive produce MAX-SAW filter oneself.

4, core advantage summary

Brilliant round class of Zhuo Shengwei encloses a technology to pass ” batch of brilliant round class is machined + RDL weighs wiring + high density protruding nods interconnection ” core principle, the miniaturization that realized filter product, tall compositive degree, high-powered (integrality of small loss, loud signal) with low cost, at the same time comfortable match demand of much setting dependability, those who be group of model of front of its radio frequency is homebred replace and the market is extended offerred a key to prop up.